Engineering Field Trip

(back row, l-r) Griselda Matos, David Ball, David Barnett (Future Electronics), Nathan Sampson, Adam Tekle, Bob Moats and Viet Minh Tong; (front row, l-r) Chisalu Jones, Ryne Stevens, Patrick Held, Dr. Pong Malasri, Minh Nguyen, John Vo and Luis Garcia

(back row, l-r) Griselda Matos, David Ball, David Barnett (Future Electronics), Nathan Sampson, Adam Tekle, Bob Moats and Viet Minh Tong; (front row, l-r) Chisalu Jones, Ryne Stevens, Patrick Held, Dr. Pong Malasri, Minh Nguyen, John Vo and Luis Garcia

A group of Packaging and Electrical Engineering students visited Future Electronics (http://www.futureelectronics.com/en/Pages/index.aspx) distribution center in Southaven, MS on April 5. Future Electronics is a world-class leader and innovator in the distribution and marketing of semiconductors and passive, interconnect and electro-mechanical components. The company operates in 42 countries with its worldwide corporate headquaters in Pointe Claire, Quebec, Canada